DeHeng Assisted TwinSolution Technology in Completing a C Round of Financing of Hundreds of Millions of Yuan

2025-04-01

Recently, Shanghai TwinSolution Technology Co., Ltd. has completed a C round of financing amounting to hundreds of millions of yuan. This round was jointly led by Jiangsu Mixed-Ownership Reform Fund and Zhongan Youxuan No.2 Investment Fund, with follow-on investments from such entities as Suzhou Zhanxin Private Equity Fund Management Co., Ltd., Jiangsu No.2 Fund, and Kunshan Yucheng Delu Private Equity Fund. The funds raised will be primarily used to expand the production capacity of mature products such as ultra-large size semiconductor test sockets and MEMS probe cards, and to support the research and development and production of new products like 2.5D DRAM/3D DUTLET MEMS probe cards and LTCC ultra-large ceramic substrates. These cutting-edge products embody TwinSolution Technology’s strategic market layout for the future and are expected to carve out a vast space in emerging fields.

DeHeng has long served as TwinSolution Technology’s legal advisor, assisting the company in completing various rounds of equity financing, employee equity incentives, and the establishment and participation of external holding platforms in capital markets. Previously, DeHeng provided full-cycle legal services for TwinSolution Technology in introducing strategic investor AccoTest, the A round of financing with Addor Capital, the A+ round project, and the B round project. For this round, the DeHeng team was led by Li Zengli, a partner from the Shanghai office, with primary support from lawyers Chen Mian and Tang Yinghua. They represented TwinSolution Technology in discussing the transaction plan, reviewing and revising transaction documents, negotiating with investors on behalf of the company, and completing this round of closing.